Airline Recognition Guide by Gunter G. Endres, Graham Edwards

By Gunter G. Endres, Graham Edwards

Airline popularity advisor КНИГИ ;ВОЕННАЯ ИСТОРИЯ Издательство: HarperCollins PublishersСерия: Jane's popularity GuideАвтор(ы): Gunter Endres, Graham EdwardsЯзык: EnglishГод издания: 2006Количество страниц: 194x2ISBN: 978-0-00-720442-7Формат: pdf (150 dpi) ~1370x1000Размер: 89,3 mb RAPIDили IFOLDER zero

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12. R. E. , Piscataway, United States (2004). 13. , Spectral contrast enhancement techniques for extrasolar planet imaging, High-Contrast Imaging for Exo-Planet Detection, Aug 23–26 2002. The International Society for Optical Engineering, Waikoloa, Hawaii (2002). 14. Siebert, P. , Petzold, , and J. Muller, Processing of complex microsystems: a micro mass spectrometer, Proceedings of the SPIE — The International Society for Optical Engineering 3680, pp. 562 (1999). 15. , Boston (2001). 16. , Scanning micromechanical mirror for fine-pointing units of intersatellite optical links, Design, Test, Integration, and Packaging of MEMS/MOEMS, May 9– 11 2000, Paris, Fr, Society of Photo-Optical Instrumentation Engineers, Bellingham, Washington (2000).

LIGA technology was demonstrated in the 1980s. , thickness or width) from metallic materials that can be electroplated. This provides advantages in applications requiring a broad set of materials. However, assembly of large numbers or arrays of devices is an issue. 3 LIGA The LIGA process13 is capable of making complex structures of electroplatable metals with very high aspect ratios and thicknesses of several hundred microns. The LIGA process utilizes x-ray lithography, thick resist layers, and electroplated metals to form complex structures.

38 Bulk Micromachining.................................................................................... 1 Wet Etching........................................................................................ 2 Plasma Etching................................................................................... 5 Sacrificial Surface Micromachining.............................................................. 1 SUMMiT V1............................................................................... 6 Integration of Electronics and MEMS Technology......................................

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